Infinera Unveils FastSMP(TM) – Next Generation Multi-Failure Network Protection Solution

SUNNYVALE, CA–(Marketwire – Mar 18, 2013) – Infinera ( NASDAQ : INFN ) announced today FastSMP™, a next generation network protection solution designed for Infinera’s DTN-X platform offering service providers increased network resiliency with protection against multiple failures while simultaneously lowering the total cost of ownership.

With FastSMP™, Infinera is delivering the industry’s only hardware-based Shared Mesh Protection (SMP) solution based on the FastSMP™ processor, a hardware acceleration chip that enables recovery from multiple-failures in less than 50 milliseconds (ms). This hardware chip is pre-installed on the DTN-X and can be enabled via a simple software upgrade ensuring complete investment protection for customers building their networks with the DTN-X. Infinera has shipped more than 2,000 100G ports to date and every port shipped is ready to be upgraded to FastSMP™.

“Current approaches to network resiliency are inadequate to meet the rapidly evolving network performance and cost requirements of service providers,” said Michael Kennedy, Principal Analyst at ACG Research. “SMP utilizes the best attributes of 1+1 protection and MPLS FRR for operators to offer a range of new services with multi-tiered protection levels. We found up to 33% lower total cost of ownership for SMP as compared with 1+1 protection.”

Infinera FastSMP™ delivers key benefits to service providers and their customers:

• Deterministic Protection: providing recovery for multiple failures within 50ms versus software-based Shared Mesh Restoration which can take multiple seconds to recover.
• Enhanced Availability: 1+1 can only protect against a single failure. FastSMP™ leverages intelligent GMPLS control to provide multiple backups with continuous real-time path re-computation ensuring better survivability for every protected service.
• Cost-effective Deployment: in contrast to 1+1 protection it allows for sharing of backup resources with priority pre-emption to lower overall capex and opex costs.

With FastSMP™ network operators can offer sub 50ms protected services like 1+1 protection but with higher availability and reduced costs. Since it utilizes the digital transport layer it provides better network economics than packet-based solutions and recovers from local as well as remote failures across thousands of nodes within 50ms offering better protection than MPLS Fast Re-Route in many scenarios.

“Pacnet’s unique position is its ability to offer true long haul submarine mesh architecture on its core network within the APAC region,” said Andy Lumsden, Pacnet Chief Technology Officer. “Our selection of the DTN-X has provided new levels of scale for our network allowing us to accommodate customer traffic and deliver high capacity services faster than our competitors. The combination of the Infinera DTN-X platform and its hardware-accelerated FastSMP™ approach will provide Pacnet with a combination of resiliency, capacity and flexibility needed to meet the highest demands of our customers.”

“Infinera is committed to being the leader in transport networking innovation,” said Dave Welch, Co-founder, EVP, and Chief Strategy Officer Infinera. “Infinera has revolutionized the industry with the DTN-X delivering 500G super-channels based on large scale photonic integrated circuits. Now Infinera FastSMP™ offers a solution that offers a more resilient mesh network, protecting our customers’ services and lowering total network cost.”

FastSMP™ is based on the emerging industry standard Shared Mesh Protection that allows transport networks to recover from multiple local and network-wide failures without the need to dedicate backup bandwidth for every active circuit. Infinera has filed patents for its hardware-accelerated FastSMP™ and is expected to start delivering multi-failure protection and restoration capabilities in 2013. For more information, visit www.infinera.com/go/fast.

Infinera and Pacnet announced today the deployment of the Infinera DTN-X across Pacnet’s subsea network in Asia.

About Infinera
Infinera specializes in Digital Optical Networking systems that are designed to continually improve the economics of optical networking by combining the speed of optics with the simplicity of digital. Infinera is unique in its use of breakthrough semiconductor technology: Large Scale Photonic Integrated Circuit (PIC). Infinera’s systems leverage PIC technology to provide customers with a service-ready architecture that enables faster time-to-revenue and greater profitability through network efficiency and the ability to rapidly deliver differentiated services without reengineering their optical infrastructure. For more information, please visit http://www.infinera.com/.

This press release contains forward-looking statements including, among other things, statements relating to Infinera product capabilities, advantages, and the current and planned future functionality including: that Infinera’s FastSMP™, a next generation network protection solution designed for the DTN-X platform, offers service providers increased network resiliency with protection against multiple failures while simultaneously lowering the total cost of ownership; that with FastSMP™ Infinera is delivering the industry’s only hardware-based Shared Mesh Protection (SMP) solution based on the FastSMP™ processor, a hardware acceleration chip that enables recovery from multiple-failures in less than 50 milliseconds (ms); that FastSMP™ leverages intelligent GMPLS control to provide multiple backups with continuous real-time path re-computation ensuring better survivability for every protected service and allows for sharing of backup resources with priority pre-emption to lower overall capex and opex costs; that with FastSMP™ network operators can offer sub 50ms protected services like 1+1 protection but with higher availability and reduced costs, provides better network economics than packet-based solutions, and recovers from local as well as remote failures across thousands of nodes within 50ms offering better protection than MPLS Fast Re-Route in many scenarios; that FastSMP™ is based on the emerging industry standard Shared Mesh Protection that allows transport networks to recover from multiple local and network-wide failures without the need to dedicate backup bandwidth for every active circuit; and that Infinera is expected to start delivering multi-failure protection and restoration capabilities in 2013. These forward-looking statements are based on our current expectations. Actual results may vary materially from these expectations as a result of various risks and uncertainties, including, but not limited to, aggressive business tactics by our competitors, our dependence on a single product, our reliance on single-source suppliers, and our ability to respond to rapid technological changes. Further information about these risks and uncertainties, and other risks and uncertainties that affect our business, is contained in the risk factors section and other sections of our annual report on Form 10-K filed with the Securities and Exchange Commission on March 5, 2013, as well subsequent reports filed with or furnished to the SEC. These reports are available on our website at www.infinera.com and the SEC’s website at www.sec.gov. Infinera assumes no obligation to, and does not currently intend to, update any such forward-looking statements.

Contact:

For media and analysts:

Media:
Anna Vue
Tel. +1 (916) 595-8157
avue@infinera.com

Investors:
Jenifer Kirtland
Tel. +1 (408) 543-8139
jkirtland@infinera.com

NXP Launches Industry’s First Dual-Modem AISG Transceiver for Wireless Base Stations

Fully Integrated, Programmable Solution Also Available With Embedded ARM(R) Cortex(TM)-M3 Processor

EINDHOVEN, THE NETHERLANDS–(Marketwire – Mar 18, 2013) – NXP Semiconductors N.V. ( NASDAQ : NXPI ) today introduced a groundbreaking family of programmable AISG transceivers for wireless base stations and antenna line devices (ALDs) such as tower-mounted amplifiers (TMAs) and remote electric tilt (RET) antennas. The new family includes the industry’s first fully integrated dual-modem AISG transceivers, as well as the first AISG system solution to integrate an ARM® Cortex™-M3 processor alongside two AISG modems. DSP-based and programmable, NXP’s AISG transceivers offer significant flexibility, making it easy to change settings during development, manufacturing, or even site installation. While many manufacturers today use a separate microcontroller and a high number of discrete components to deliver AISG on-off keying (OOK) modem functionality, the exceptionally high level of integration delivered by NXP’s transceivers helps to reduce the total component count, board space and costs, while introducing advanced functionality.

Remote electric tilt enables dynamic adjustment of base station antenna beams for optimal network coverage, and is becoming a standard feature for wireless base station antennas. By embedding AISG transceiver functionality inside the antenna itself to control the RET, infrastructure providers can eliminate additional Smart-Bias-T and RS485 cabling to the antenna, increasing reliability while reducing tower costs. NXP’s dual-modem AISG devices are particularly suitable for ALDs with multiple feeder cable connections, like TMAs and multiband antennas. Further, the AISG transceivers can be used as part of a larger framework, outlined separately by NXP in a white paper released today, to enable remote “site scans” and monitoring of mobile tower cabling connectivity failures, which typically requires costly, inefficient tower climbing and visual inspections. A video overview of NXP’s AISG transceivers is available here: http://youtu.be/uxU2FJSIZuc

“While the Antenna Interface Standards Group protocol has been a major step in the right direction, the fact remains that there is still no way to effectively gather information on mobile tower connectivity remotely. With the growth of 3G and LTE, the complexity of wireless base stations and the number of antennas and other devices installed from various manufacturers will increase dramatically — compounding maintenance costs and headaches for both network operators and equipment manufacturers,” said Rick Dumont, global marketing director for AISG products, NXP Semiconductors. “Our new AISG transceivers provide a compact and cost-effective solution for multi-channel AISG communication between tower-mounted ALDs and the base station to optimize base station site performance. At the same time, we’re opening the door to better interoperability across components, which could ultimately allow remote monitoring, diagnostics and debugging of a wider range of devices in the tower.”

AISG transceivers with multi-carrier feature
The single-modem ASC3011 and dual-modem ASC3012 are power-efficient, highly integrated AISG modems in a small HVQFN64 package. The modems can interface via a two- or three-wire UART or with an RS485 transceiver, and modem parameters can be programmed using an I2C interface. Up to 4 NXP AISG transceivers (providing up to 8 AISG OOK modems) can be connected to a single I2C-bus, and each modem can be programmed with its own settings as required by the base station site.

In addition to the default AISG carrier frequency of 2.176 MHz, all NXP AISG transceivers also support 4.352-MHz and 6.528-MHz carrier frequencies. This offers the possibility of multiplexing 3 AISG channels on the same RF feeder cable. Receiver bandpass filters are integrated to effectively block any out-of-band interference signals. Users can program the receiver sensitivity to “High” and “Ultra High” levels, in addition to standard AISG sensitivity. The transmitter can deliver up to 10 dBm power to the RF feeder cable, and can have an integrated 50-ohm receiver and transmitter termination. The transceivers conform to AISG1: Issue 1.1 and AISG v2.0.

AISG transceivers with embedded ARM Cortex-M3 microcontroller
The single-modem ASC3101 and dual-modem ASC3112 are optimized AISG controllers, including a 94-MHz ARM Cortex-M3 processor with integrated AISG modem(s) and all peripheral interfaces required to control antenna line devices. These peripherals include 6 PWM outputs to drive RET antenna motors, and a number of general purpose ADCs/DACs for measurement and control functions.

The integrated AISG transceivers with the embedded ARM processor are shipped with a full software development kit (SDK), including the reference AISG stack for basic control and power management, which is provided to all NXP AISG customers to promote device interoperability. Each controller offers up to 256 kB of embedded flash and 16 kB of SRAM to run the application software. In addition, a real-time clock with 32 kHz crystal and 44 configurable GPIOs are available. The DSP-based modem also facilitates field upgrades for higher transfer speeds that comply with future protocols. The programmable modems enable optimization of receiver sensitivity, based on signal strength.

Availability
The ASC3101, ASC3112, ASC3011 and ASC3012 are currently sampling with lead customers, with volume manufacturing starting at the end of March 2013.

Links

• VIDEO: Introducing NXP’s dual-modem AISG transceivers for wireless base stations:
  http://youtu.be/uxU2FJSIZuc
• NXP AISG transceivers and controllers: http://www.nxp.com/products/rf/aisg_transceivers_and_controllers/
• WHITE PAPER: Proposal for Basestation Site Scanning with AISG Modems:
  http://www.nxp.com/documents/white_paper/NXP_Basestation_Site_Scanning_proposal_with_AISG_modems_web.pdf

About NXP Semiconductors
NXP Semiconductors N.V. ( NASDAQ : NXPI ) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted unaudited revenue of $4.36 billion in 2012. Additional information can be found by visiting www.nxp.com.

Forward-looking Statements

This document includes forward-looking statements which include statements regarding NXP’s business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP’s products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP’s relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers’ equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP’s business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP’s market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov.

Mellanox Technologies to Present InfiniBand Interconnect Solutions with ColorChip

YOKNEAM, Israel–(BUSINESS WIRE)–

Mellanox® Technologies, Ltd. (MLNX) (MLNX.TA), a leading supplier of high-performance, end-to-end interconnect solutions for data center servers and storage systems, will hold a joint demonstration with ColorChip, a leading supplier of high speed transceivers, at the upcoming OFC/NFOEC Exposition. The joint demonstration will feature Mellanox MetroX™ long-haul systems and ColorChip’s newly released 56G QSFP+ IB-4X-FDR Transceiver module, an extension of ColorChip’s active optical module line. The demonstration will take place at the ColorChip booth (#3327) during OFC/NFOEC, March 19th-21st, 2013 in Anaheim Convention Center, CA.

About ColorChip
ColorChip (http://www.color-chip.com) is a pioneer and a world leading innovator in the fields of Integrated Optical Components and Sub-Systems enabling reliable, scalable and robust high speed networking and communications solutions. Through two lines of business, ColorChip delivers industry leading optical high-speed transceivers to the Datacom/Telcom markets and passive optical splitters to the FTTx markets. ColorChip’s team bring decades of multidisciplinary electro-optic experience, operational expertise and dedicated research and development of advanced Application Specific Photonic Integrated Circuits (ASPICs). ColorChip robust PLC, waveguides-in-glass technology and the revolutionary SystemOnGlass™ platform have been proven invaluable in every product launch. Through this foundation and uncompromising corporate governance, ColorChip was able to build a wide array of products and solutions and to serve customers worldwide.

Contact:
Yigal Ezra,
+972 4 630 0200
VP Business Development
yigal@color-chip.com

Menara Networks Announces Metro 100G DWDM Breakthrough with Tunable DWDM CFP Transceiver with Integrated OTN and FEC Capabilities for Metro and Data Center Interconnection at OFC/NFOEC 2013

ANAHEIM, Calif.–(BUSINESS WIRE)–

Menara Networks, a vertically integrated optical IP/Ethernet transport specialist, introduces today a transponder replacement for 100G DWDM transmission for metro and data center interconnection with its latest “System-in-a-Module” 100G OTN CFP pluggable transceiver.

Menara 100G “System-in-a-Module” integrates OTU4 framing, ultra FEC, full C-band tunability and 100GE performance monitoring in a 100% MSA compliant CFP form factor with a standard CAUI interface. It maps 100GE payload into an ITU G.709 compliant OTU4 frame while offering non-intrusive monitoring of the Ethernet frame statistics. ITU G.975.1 compliant forward error correction is supported with configurable coding gain up to 9.4dB for use over amplified DWDM systems. The OTU4 signal is then transmitted using optical duo-binary signal (ODB) dispersion tolerant modulation over 4 optical channels on the ITU 50 GHz grid. Each of the four channels can be independently tuned over any of the 102 channels supported on ITU 50 GHz grid. Menara’s patented “System-in-a-Module” offers a PRBS line performance checker/generator, an extensive set of OTU4 Performance monitoring pints and alarms and has a built-in OTN SNMP MIB accessible through the front Ethernet face plate for ease of configuration and management. The company announced it has received an order from a Tier-1 system vendor for this product.

Menara is also announcing the Armada 1000-GM, a 1RU 100G WDM transport solution that offers 100G transponder and 10G/40G muxponder functions into a tunable CFP based OTU4 100G uplink. The compact Armada 1000-GM also includes integrated EDFA optical amplifiers and dispersion compensating modules offering a complete 100G DWDM transmission solution for metro and data center interconnection applications in a compact 1 RU footprint.

“There is an expected sharp growth of DWDM traffic in metro networks driven largely by data center-to-data center interconnection,” observes Eve Griliches, Vice President of Optical Networking at ACG Research, an analyst and consulting company that focuses in the networking and telecom space. “The coherent 100G solutions currently deployed in the core of the networks do not meet the cost or the power consumption points commensurate with this market just yet and Menara’s integrated solution effectively addresses this market need.”

“Menara Networks continues on its march to simplify the optical network and help carriers and data center operators bridge the gap between the growing network cost and the declining revenue per bit,” said Siraj Nour ElAhmadi, Menara Co-Founder and CEO. “We continue to believe that WDM transmission is a cost and not a revenue center to service providers. Our latest DWDM 100G “System-in-a-module” OTN CFP brings the same level of disruption to the economics, size and power of 100G WDM transmission as our OTN XFP did to 10G transmission.”

Menara Networks will be conducting live demonstrations of its Metro DWDM OTN CFP and other products at its booth # 1421 on the exhibit floor of this year’s OFC/NFOEC conference taking place in Anaheim, CA from March 19 thru March 21. The demonstration will be conducted in an environment that emulates metro fiber networks and will also include 100GE, and OTU4 interoperability testing using EXFO FTB-500 next-gen network testing platform and Xena Networks XenaCompact 100GE testing platform. For more information and/or order placement, please contact info@menaranet.com.

About Menara Networks

Menara Networks develops innovative products and solutions that greatly simplify today’s layered optical transport networks. Leveraging the company’s proprietary high speed ICs and its extensive expertise in optical networking and system design, Menara portfolio of OTN XFP, SFP+ and CFP modules provide optical networks with superior performance and improved service velocity while drastically reducing floor space, power consumption and overall network cost. The company’s unique solutions continue to save carriers millions of CapEx dollars and eliminate the need for footprint, heat, and power associated with DWDM transponders in central offices and data centers around the world. For more information, visit www.menaranet.com.

Contact:
Menara Networks, Inc.
Sri Nathan, 714-343-1888
VP of Business Development
sri@menaranet.com

NeoPhotonics Announces New Variable Power Intradyne Coherent Receiver (VICR) for High-Capacity 100G Optical Networks

New VICR is Designed to Improve Signal-to-Noise Ratio and Increase Coincident Channel Count in “Colorless” 100G Coherent Systems

ANAHEIM, Calif.–(BUSINESS WIRE)–

NeoPhotonics Corporation (NPTN), a leading designer and manufacturer of photonic integrated circuit, or PIC, based modules and subsystems for bandwidth-intensive, high speed communications networks, today announced a new 100G Variable Power Intradyne Coherent Receiver (VICR). The PIC-based VICR integrates a variable optical attenuator (VOA) on the signal path and is designed to increase dynamic range and improve the optical signal to noise ratio (OSNR) for both single channel and multiple coincident signals. This capability is designed to enable service providers to better manage network capacity in colorless coherent networks. NeoPhotonics is currently sampling the VICR and expects to enter general availability with this product in the second half of 2013.

Core networks are rapidly moving towards more efficient “colorless” operation, meaning that ROADM add and drop ports are not limited to fixed predetermined wavelength channels. Instead, a tunable transmitter can connect any wavelength to any add port and the ROADM can route any wavelength to any drop port receiver. Colorless operation improves the efficiency of valuable line cards and transponders in coherent transport networks, where a single DWDM channel carries 100Gbps of information.

In coherent optical communications systems the colorless channel drop operation is enabled by using the local oscillator laser and the VICR to select the receive channel, eliminating the need for a terminal optical filter. The VICR then detects the signal channel to which the local oscillator laser is matched, but all other channels are outside the device bandwidth. In colorless applications the remaining channels are not filtered out optically, so the incoming signal power to the VICR can vary significantly depending on how many other channels are present, resulting in up to 100 times higher power falling on the receiver than in the single channel case. The NeoPhotonics VICR integrates a PIC variable optical attenuator that provides control and stability to the input signal. In both colorless and conventional optically filtered systems, the VOA also improves performance by allowing system selection of the optimal operating point to enhance OSNR and reduce the effects of optical impairments such as polarization dependent loss (PDL).

“We are pleased to add the VICR to our extensive line of PIC based intradyne coherent receivers,” said Tim Jenks, Chairman and CEO of NeoPhotonics. “The VICR illustrates the power of photonic integration to provide additional functionality to our existing products, which are designed to benefit our customers with improved performance in the same form factor and simplified board layouts.”

NeoPhotonics is showcasing the VICR alongside its existing product portfolio, including other intradyne coherent receivers and narrow linewidth tunable lasers for 100G coherent communications, its 100G CFP and CFP2 transponders for client side transmission and an extensive line of OLT transceivers for FTTH PON networks, at the OFC Exhibition in Anaheim, California (March 19-21, 2013, Anaheim Convention Center, Booth 1601).

In addition, NeoPhotonics personnel are participating in a workshop and a panel devoted to PON access applications and presenting a paper on ROADM-based wavelength agility:

• Dr. David Piehler, Chief Scientist, Access Products, will discuss the topic, “Statistical WDM is antifragile,” in Workshop OM1D: Can Access Networks Afford to be Wavelength Agile?, Monday, March 18th, 9:00 AM – 12:00 PM in Room: 303D. This workshop will examine architectural and cost considerations in the coming multi-wavelength PON systems and optical distribution networks (ODN).
• Also on Monday, 4:00 PM – 6:00 PM in Room: 304C, Dr. Piehler will give a presentation on “Scaling PON OLT port utilization – HFC style,” in connection with Panel NM3J: PONs as Used by MSOs. This panel will consider the role of PON architectures for commercial and residential services in MSO networks and the timing of PONs in the residential sector.
• Dr. Winston Way, Chief Systems Architect, and two co-authors from NEC Laboratories America, will present the paper: “Contention resolution within colorless and directionless ROADM,” Wednesday March 20th, 8:00 AM in Room: 304C.

About NeoPhotonics

NeoPhotonics is a leading designer and manufacturer of photonic integrated circuit, or PIC, based optoelectronic modules and subsystems for bandwidth-intensive, high-speed communications networks. The company’s products enable cost-effective, high-speed data transmission and efficient allocation of bandwidth over communications networks. NeoPhotonics maintains headquarters in San Jose, California and ISO 9001:2000 certified engineering and manufacturing facilities in Silicon Valley (USA) and Shenzhen, China. For additional information, visit www.neophotonics.com.

© 2013 NeoPhotonics Corporation. All rights reserved. NeoPhotonics and the red dot logo are trademarks of NeoPhotonics Corporation. All other marks are the property of their respective owners.

Forward Looking Statements

This press release contains forward-looking statements. Readers are cautioned that these forward-looking statements are only predictions and may differ materially from actual future events or results. These forward-looking statements involve risks and uncertainties, as well as assumptions and current expectations. The company’s actual results and the timing of events could differ materially from those anticipated in such forward-looking statements as a result of these risks, uncertainties and assumptions. The risks and uncertainties that could cause the company’s results to differ materially from those expressed or implied by such forward-looking statements include but are not limited to: acceptance by customers of the VICR or the timing of such acceptance may not be as the company expects; the timing of or costs related to the development, general availability and performance and production of the VICR may not be as the company expects; the demand for the VICR may be volatile or lower than the company expects; demand for the VICR could decrease from the company’s expectations due to general conditions in the telecommunications equipment industry, changes in network architectures, or the world economy generally, and other risks and uncertainties described more fully in the company’s documents filed with or furnished to the Securities and Exchange Commission.

Contact:
LouVan Communications Inc.
Michael Newsom, +1 508-530-3121 (Office) or +1 617-803-5385 (Mobile)
mike@louvanpr.com