Teknovus Provides EPON Chipsets for Deployment of Triple-Play Residential and Business Services in Broadband Access Networks
Teknovus Presents 10G EPON at Broadband World Forum Europe 2009
Teknovus, the leading provider of Ethernet Passive Optical Network (EPON) chipsets for deployment of triple-play residential and business services in broadband access networks, announced that Teknovus’ Chairman Dr. Niel Ransom will be presenting at Broadband World Forum Europe. Dr. Ransom will discuss the deployment scenarios that have led to more than 25 million EPON-based fiber network subscribers today and the adoption plans for 10G EPON. He joins ZTE’s panel on Next-Generation PON Networks on September 7th at 10 am at CNIT in La Defense Paris.
Teknovus’ EPON chips and embedded software are being deployed by major communications equipment vendors across five continents, supporting fiber-based access. Teknovus’ 10G-EPON, with its built-in traffic management capabilities, is an excellent fit for high density environments and large enterprises, where Service Level Agreements (SLAs) and Quality of Service (QoS) for voice, data, and video services must be guaranteed to hundreds of subscribers simultaneously. In addition, Teknovus’ chip architecture includes support for 2G, 3G, and 4G cellular-backhaul clock/phase and TDM transport, enabling a unified roadmap for all wireline and wireless services.
“We are delighted to join ZTE in presenting Next Generation PON at Broadband World Forum Europe,” stated Dr. Niel Ransom, Teknovus Chairman and former CTO of Alcatel. “ZTE is a worldwide leader in fiber access equipment, using Teknovus’ chips for both networking and customer premises. We are working closely with ZTE on next generation EPON, including 10G, advanced optical monitoring and fault localization, and protection switching. Teknovus’ early penetration in Japan, Korea and China is spreading to both Eastern and Western Europe with testing underway by tier 1 European carriers.”
Dr. Niel Ransom, Career Highlights
Dr. Niel Ransom has played a strategic role in developing key technologies in the telecommunications industry for over 30 years. Before becoming worldwide Chief Technology Officer at Alcatel, he managed Alcatel’s access and metro optical business in North America. Dr. Ransom joined Alcatel from BellSouth where he directed an organization responsible for expanding BellSouth’s offerings into PCS wireless, broadband access, video entertainment and advanced intelligent networks. He began his career at Bell Labs where he managed an applied research organization that gave birth to a number of highly successful products in data and voice switching. Dr. Ransom has served as a member of the Technological Advisors Council of the US Federal Communication Commission (FCC). He is a co-author of Broadband Access Technologies, published by McGraw-Hill. Dr. Ransom holds a Ph.D. in Electrical Engineering from the University of Notre Dame, BSEE and MSEE degrees from Old Dominion University, and an Executive MBA from the University of Chicago.
About Teknovus
Teknovus is the leading developer and supplier of access chips and embedded software for the FTTx market, supporting EPON (Ethernet Passive Optical Networking) at 1G, 2.5G and 10G speeds. Teknovus products are deployed by more than 35 service providers around the world, enabling the delivery of advanced triple-play services, including IPTV, via optical fiber networks. Teknovus products support the full FTTx network, covering the Central Office (OLT) and the Customer Premises (ONU). Teknovus is headquartered in Petaluma, California with sales, design and support centers in Tokyo, Seoul, Beijing, Shanghai, Hong Kong, San Jose and Boston. To learn more about Teknovus, visit www.teknovus.com.
